Dow Corning DC 340 heat sink compound is a white, non-curing and non-flowing thermally conductive compound for improving the thermal coupling of an electrical or electronic devices to a heat sink. This is achieved by creating an intimate bond between the surface of the device and the heat sink.

• Non-flowing
• Moderate thermal conductivity
• No need for ovens or curing
• Heat flow away from electronic components can increase reliability
• Supplied in a 100g tube
• Dow Corning type DC 340

This heat transfer compound from Electrolube is a non-melting, non-hardening compound with high thermal conductivity and is ideal for thermal coupling of components.

• Ideal for use with medium to high power semiconductors and heatsinks
• The compound formulation is silicone-free
• Supplied in 2ml syringe
• Electrolube type HTC02S

This heat transfer compound from Electrolube is a non-melting, non-hardening compound with high thermal conductivity and is ideal for thermal coupling of components.

• Ideal for use with medium to high power semiconductors and heatsinks
• The compound formulation is silicone-free
• Supplied in 35ml syringe
• Electrolube type HTC35L

Electrolube HTCP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components to heatsinks, chassis, etc. HTCP is a non-silicone paste and is therefore suitable for applications where silicones are prohibited, avoiding issues with silicone and low molecular weight siloxane migration.

• High thermal conductivity
• Optimum efficiency of heat dissipation
• Low viscosity for ease of application
• Designed for use as a thermal interface material
• Based on a non-silicone oil
• Avoids issues with silicone and LMW siloxane migration
• Non-curing paste
• Allows simple and efficient rework of components if required
• Supplied in a 20ml syringe
• Electroluble type HTCP

Electrolube HTSP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material.

It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components.

HTSP is based on a silicone oil and offers an exceptionally wide operating temperature range.

• High thermal conductivity for optimum efficiency of heat dissipation
• Very low viscosity for ease of application
• Designed for use as a thermal interface material
• Based on silicone oil
• Exceptionally wide operating temperature range
• Non-curing paste allows simple and efficient rework
• Supplied in a 1kg bulk can
• Electrolube type HTSP01K

The KP97 is a thermal grease compound that has a 5.0W/mK thermal conductivity value. The grease is a ceramic-filled single-component Silicone that does not dry out and where the Silicone component doesn't leak out of the compound. The long lifetime of this thermal grease guarantees full operability over the entire lifetime of the products and special storage is not required so that it may be stored under normal conditions for up to 12 months.

• Supplied in 30g tube
• Non-crosslinked thermal compounds
• Excellent long-term stability

This Kontakt Chemie 32044-AB Heat Sink Compound is used to increase the thermal conductivity and the efficient heat dissipation of electronic components.

• High thermal conductivity
• Excellent moisture buffer
• Low metallic impurity content