PLCC socket with 28 ways, 2.54mm pitch, suitable for JEDEC plastic leaded chip carrier packages with industry standard pin outs.

• Phosphor bronze contact material
• Tin over nickel contact plating
• Glass-filled PBT housing material
• Square package configuration
• Heat resistant PBT resin
• Contact design prevents IC from vibrating loose
• Twin slots provided for easy extraction of IC

PLCC socket with 32 ways, 2.54mm pitch. Suitable for all electronic PC boards requiring the conversion of 0.05in pitch chip carrier to a 0.1in x 0.1in grid through board.

• Phosphor bronze contact material
• Tin over nickel contact plating
• PBT housing material
• Square package configuration
• Visual and mechanical polarisation for PLCC insertion
• Closed bottom for excellent protection
• Solder wicking into contact area
• Moulded-in stand-offs allow easy removal of flux residue
• Extraction tool slots
• Open top design for cooler running chip carrier

SMT very low profile PLCC socket with 32 ways, 2.54mm pitch.

• Phosphor bronze contact material
• Tin over nickel contact plating
• Glass filled PPS housing material
• Square package configuration
• Surface mount design
• Design prevents the IC from vibrating loose
• Twin slots provided for easy extraction of the IC

PLCC socket with 44 ways, 2.54mm pitch, suitable for JEDEC plastic leaded chip carrier packages with industry standard pin-outs.

• Phosphor bronze contact material
• Tin over nickel contact plating
• Glass-filled PBT housing material
• Square package configuration
• Heat resistant PBT resin
• Contact design prevents the IC from vibrating loose
• Twin slots provided for easy extraction of the IC

SMT very low profile PLCC socket with 44 ways, 2.54mm pitch.

• Phosphor bronze contact material
• Tin over nickel contact plating
• Glass filled PPS housing material
• Square package configuration
• Surface mount design
• Design prevents the IC from vibrating loose
• Twin slots provided for easy extraction of the IC

PLCC socket with 68 ways, 2.54mm pitch, suitable for JEDEC plastic leaded chip carrier packages with industry standard pin-outs.

• Phosphor bronze contact material
• Tin over nickel contact plating
• Glass-filled PBT housing material
• Square package configuration
• Heat resistant PBT resin
• Contact design prevents IC from vibrating loose
• Twin slots provided for easy extraction of the IC

PLCC socket with 84 ways, 2.54mm pitch, suitable for JEDEC plastic leaded chip carrier packages with industry standard pin-outs.

• Phosphor bronze contact material
• Tin over nickel contact plating
• Glass-filled PBT housing material
• Square package configuration
• Heat resistant PBT resin
• Contact design prevents IC from vibrating loose
• Twin slots provided for easy extraction of the IC