A high performance thermally conductive material for applications requiring high thermal conductivity, the pads can be applied to either the heatsink or the device and are specifically designed for low mounting pressure applications, clip-mount pads have no fixing holes, .

• Sil-Pad 900S low-pressure insulating material
• Pink colour
• 0.009in thick
• 1.6W/m-K thermal conductivity
• Temperature range -60°C to +180°C
• 5500V breakdown voltage
• 1300psi tensile strength
• 0.2°C/W thermal resistance
• TO-220
• 19.05mm long
• 12.7mm wide
• Supplied in pack of 10

Bond-Ply 100 is a thermally conductive and electrically isolating, pressure sensitive adhesive material that facilitates the decoupling of materials with mismatched thermal coefficients of expansion.

The double-sided adhesive coating with its high bond strength that immediately bonds to the target surface, together with excellent wet-out and high thermal performance, make this material ideally suited for use as a replacement for heat-cure adhesive and screw- or clip-mounting solutions.

• Colour: white
• Size 12 x 12in
• 0.86W/m-K Thermal conductivity
• Acrylic/fibreglass material
• Bond strength increases over time
• Rated to UL 94V-0

Gap Pad 2000S40 is a highly conformable, reinforced, gap-filling material from Bergquist that provides high thermal conductivity at very low mounting pressures. This grey material is electrically isolating and is suitable for isolation between heat sinks and bare-leaded, high voltage devices.

Fibreglass reinforcement of the material enables easier handling and superior puncture, shear and tear resistance. High material conformability ensures it fills in air voids and gaps between heat sinks and devices.

• 2.0W/m-K Thermal conductivity
• Low thermal resistance at very low mounting pressures
• Inherently tacky on both sides – aids in assembly
• Low hardness with high conformability
• Designed for low-stress applications
• Rated to UL 94V-0
• Supplied in 4 x 4in sheet
• Thickness 0.04in

Bergquist Sil-Pad 400 0.007" 12" x 12" sheet is designed to replace grease and mica for power applications and is ideal for reducing assembly time and maintaining cleanliness in production environments. Consists of a glass fibre sheet coated with a thermally conductive silicon elastomer.

• Grey colour
• 0.007in thick
• 0.9W/m-K thermal conductivity
• -60°C to +180°C
• 3500Vac breakdown voltage
• Silicone/fibreglass material
• 3000PSI tensile strength
• 0.4°C/W thermal resistance, TO-220
• Without adhesive backing

Bergquist Sil-Pad 400 TO-220 Adhesive Pads (Pack of 22) designed to replace grease and mica for power applications and is ideal for reducing assembly time and maintaining cleanliness in production environments. Consists of a glass fibre sheet coated with a thermally conductive silicon elastomer.

• Grey colour
• 0.007in thick
• 0.9W/m-K thermal conductivity
• -60°C to +180°C
• 3500Vac breakdown voltage
• Silicone/fibreglass material
• 3000PSI tensile strength
• 0.4°C/W thermal resistance
• 19.05mm long, 12.7mm wide
• With adhesive backing

A high performance thermally conductive material for applications requiring high thermal conductivity, the pads can be applied to either the heatsink or the device and are specifically designed for low mounting pressure applications, clip-mount pads have no fixing holes, .

• Sil-Pad 900S low-pressure insulating material
• Pink colour
• 0.009in thick
• 1.6W/m-K thermal conductivity
• Temperature range -60°C to +180°C
• 5500V breakdown voltage
• 1300psi tensile strength
• 0.2°C/W thermal resistance
• TO-220
• 25.4mm long
• 19.1mm wide
• Supplied in pack of 10

A high performance thermally conductive material for applications requiring high thermal conductivity, the pads can be applied to either the heatsink or the device and are specifically designed for low mounting pressure applications, clip-mount pads have no fixing holes, .

• Sil-Pad 900S low-pressure insulating material
• Pink colour
• 0.009in thick
• 1.6W/m-K thermal conductivity
• Temperature range -60°C to +180°C
• 5500V breakdown voltage
• 1300psi tensile strength
• 0.2°C/W thermal resistance
• TO-220
• 19.05mm long
• 12.7mm wide
• Supplied in pack of 10

These thermal pads from Bergquist are designed to resist puncturing due to burrs or high pressures when mounting semiconductor devices to heatsinks. Constructed from Kapton and a thermally conductive elastomer coating loaded with aluminium oxide/boron nitride applied to both sides, K6 couples high dielectric strength with a no grease, no mess method of assembly.

• Blue green colour
• Size 19.05 x 12.7mm
• Thickness 0.006in
• 1.1W/m-K Thermal conductivity
• Suitable to fit TO-220
• Supplied in packs of 10

A TO-220 size 70/50 transistor mounting pad with a very smooth surface, giving it excellent thermal properties and insulation performance at low mounting pressures. Suitable for pressure sensitive applications in automotive, AV, domestic equipment, power converters, LCD display applications.

• Thermal conductivity 1.4W/mK
• Wide temperature range
• Flame class UL 94V-1

A TO-247 size 70/50 transistor mounting pad with a very smooth surface, giving it excellent thermal properties and insulation performance at low mounting pressures. Suitable for pressure sensitive applications in automotive, AV, domestic equipment, power converters, LCD display applications.

• Thermal conductivity 1.4W/mK
• Wide temperature range
• Flame class UL 94V-1

A TO-3 size 70/50 transistor mounting pad with a very smooth surface, giving it excellent thermal properties and insulation performance at low mounting pressures. Suitable for pressure sensitive applications in automotive, AV, domestic equipment, power converters, LCD display applications.

• Thermal conductivity 1.4W/mK
• Wide temperature range
• Flame class UL 94V-1

A 40 x 40 x 0.3mm double-sided adhesive film which is a ceramic-filled thermally conductive pad that has high thermal conductivity and good dielectric properties. The excellent adhesion behaviour and soft surface finish together with light weight, easy handling and high elasticity makes this thermal pad ideal for applications where surface conformity and ease of installation are issues. Typical applications include power supplies and inverters, computing devices and automotive electronics.

• Thermal conductivity 1.4W/mK
• High backfilled ceramic tape
• Low thermal contact resistance
• No mechanical fixation required
• Flame rating UL 94V-0

A 100 x 100 x 0.25mm thermal pad that has a design and construction that make it especially suitable for high-power applications. The 86-82 compound filler is reinforced with fibre glass and the pad has excellent thermal and electrical properties. Suitable for `high end` solutions, controlling boards, BGA applications, hard disc drives.

• Thermal conductivity 6.5W/mK
• Type 86/82
• Ideal for densely packed electronic applications
• Fibre glass reinforcement
• Flame class UL 94V-0

A 190 x 190 x 0.25mm thermal pad that has a design and construction that make it especially suitable for high-power applications. The 86-82 compound filler is reinforced with fibre glass and the pad has excellent thermal and electrical properties. Suitable for `high end` solutions, controlling boards, BGA applications, hard disc drives.

• Thermal conductivity 6.5W/mK
• Type 86/82
• Ideal for densely packed electronic applications
• Fibre glass reinforcement
• Flame class UL 94V-0

A 3W/mK Softtherm 86/300 thermal pad with dimensions of 100 x 100 x 0.5mm. The pad has excellent thermal behaviour, with low thermal resistance, good heat dissipation and good dielectric strength. Good mechanical performance ensures reliable functioning and simple application.

• Optimised thermal transition
• Good properties even at very low contact pressure
• Fully crosslinked
• High self-adhesion
• Flame class UL 94V-0

A 3W/mK Softtherm 86/300 thermal pad with dimensions of 100 x 100 x 1mm. The pad has excellent thermal behaviour, with low thermal resistance, good heat dissipation and good dielectric strength. Good mechanical performance ensures reliable functioning and simple application.

• Optimised thermal transition
• Good properties even at very low contact pressure
• Fully crosslinked
• High self-adhesion
• Flame class UL 94V-0

A 3W/mK Softtherm 86/300 thermal pad with dimensions of 200 x 120 x 1mm. The pad has excellent thermal behaviour, with low thermal resistance, good heat dissipation and good dielectric strength. Good mechanical performance ensures reliable functioning and simple application.

• Optimised thermal transition
• Good properties even at very low contact pressure
• Fully crosslinked
• High self-adhesion
• Flame class UL 94V-0

This 100 x 100 x 0.5mm Keratherm thermal pad has excellent thermal properties and good dielectric strength. The compressibility and low Shore hardness of this thermal pad ensure a reliable thermal contact. Suitable for applications such as heat pipe thermal solutions, automotive engine management systems, plasma supply consoles, RD-RAM memory modules, etc.

• Thermal conductivity 6W/mK
• Excellent heat dissipation

This 50 x 50 x 0.5mm Keratherm thermal pad has excellent thermal properties and good dielectric strength. The compressibility and low Shore hardness of this thermal pad ensure a reliable thermal contact. Suitable for applications such as heat pipe thermal solutions, automotive engine management systems, plasma supply consoles, RD-RAM memory modules, etc.

• Thermal conductivity 6W/mK
• Excellent heat dissipation

The T-Pad 6500 is a non-silicone electrically isolating thermal interface material that features an exceptionally high 6.5W/mK of thermal conductivity. The pad is perfect for rugged and demanding applications as well as silicone sensitive applications. The inherent softness in the pad allows it to fill-in the micro air voids between contact surfaces and its rugged construction stands up to demanding environments.

• 6.5W/mK Thermal conductivity
• High dielectric strength
• Guaranteed electrical isolation
• Flammability rating UL 94-V0
• Supplied in 100x100mm sheets
• Tolerance +/- 2%

T-Pad 1500 is a soft thermal interface pad designed to provide good thermal resistance and high dielectric strength while remaining cost effective.

• 100 x 100mm pad
• T-Pad 1500 interface pad
• Yellow colour
• 0.23mm thick
• 1.5W/m-K thermal conductivity
• -50 to +200°C
• 6000V AC breakdown voltage
• 20N/mm tensile strength
• Electrically isolating
• Enhances the heat flow from electronic components to heat sink
• Fibre glass reinforcement
• Rugged and strong