This 100R 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 1k 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 10k 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 220R 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 2k2 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 22k 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 330R 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 470R 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 4k7 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

This 47k 2% thick film resistor network from Bourns is housed in a 16-pin dual in-line package. Each package contains eight individual isolated resistors. Considerably assists in the design of and layout of printed circuit boards, especially in logic circuits.

• Reduces assembly time
• Ideal for high density applications
• Bourns 4116R series

Thick film 1k 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 10k 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 100k 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 2k2 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 22k 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 470R 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 4k7 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 47k 2% 5-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 1k 2% 6-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 10k 2% 6-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 100k 2% 6-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 2k2 2% 6-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 22k 2% 6-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 4k7 2% 6-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 100R 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 1k 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 10k 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 100k 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 2k2 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 330R 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 4k7 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 47k 2% 8-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 1k 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 10k 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 100k 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 220R 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 2k2 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 22k 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 330R 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 470R 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 4k7 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 47k 2% 9-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 1k 2% 10-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 10k 2% 10-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 220R 2% 10-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 2k2 2% 10-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 3k3 2% 10-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 470R 2% 10-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 4k7 2% 10-pin commoned resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design

Thick film 100R 2% 8-pin isolated resistor network housed in single in line, low profile package coated with a special epoxy resin.

• Metal glaze elements on a ceramic substrate
• Suitable for use in high density circuit design